台湾chroma 2D/3D晶圆量测系统 7980

Applications

Wafer   Size

Up   to 12"

Processes   Monitor

TSV:   TCD, BCD, Depth;

RDL:   TCD、BCD、Depth Bump Height、Step Height UBMOverlay

Film   Thickness Surface Profile

Configurations

Automation

Semi-Automatic   / Fully Automatic

Objective   Selection

3D   Lens: 5X, 10X, 20X, 50X (Others available)
2D Lens: 2.5X, 5X, 50X, 100X (Others   available)

Illuminator

LED

Focus

Motorized   manual/automated

Z-Drive(Focus)   Stage

60   mm

Motorized   Stage

Travel   range: X: 475 mm, Y: 410 mm

Isolation

Active   Isolation system

Chuck

12"   wafer fixture with vacuum

System   Controller

i7   class PC with running under Microsoft Windows 10 (64-bit)

Software

Application   Software and UI SECS/GEM

Facility

Clean   Room

ISO   Class 5

Power

AC   220V±10%

* Specifications are subject to change without   notice.