台湾chroma 桌上型单站测试分类机 3111

Temperature Range

Operation Mode : Ambient ~ 125 ℃ (Heating time : within 30 min.)

Dimension of Test Board

200mm x 200mm from socket center

Test board height : 70mm

Dimension (WxDxH)

600mm x 570mm x 810 mm (signal tower   excluded)

Net Weight

80 kg

Facility

Power : AC 220V~240V, 50Hz/60Hz,   single-phase, 2.3kva

Dry Air of 5.0 kg/cm² (0.5 MPa) or   higher, 80L/min. constant supply

Device Type

Type : BGA series, _BGA, QFP series,  
QFN, Flip-Chip, TSOP Package size : 5 mm x 5 mm to 45 mm x 45 mm

Thickness : 0.5 mm to 5 mm

Lead / Ball pitch : 0.4 mm / 0.5   mm and above

Test Site

Single site

Jam Rate

1/3000

Tray Classification

1 category

Tray

JEDEC

Binning

128 software bins

Rotator

±90˚

Contact Force

10 kgf ~ 50 kgf (±1kgf)

Contact Mode

Direct contact / Drop and press

Tester Interface

Standard : RS-232, TCP/IP

Option : GPIB

Socket CCD (option)

CCD checks socket to prevent double   stack of parts in the socket