3180 八站逻辑测试分类机
3180是一款运用Pick & Place技术的量产型机台,适合高产出多测试站点的IC测试,节省了厂房空间、测试时间和成本。3180创新的设计可提高生产力和生产效率,机台可配置作单站、双站、四站或八站测试,亦可升级作高温150℃测试.
3180有高可靠性的处理机制,可依据测试需求支持各种不同类型封装的芯片,且能与通用生产治具兼容,顺畅的自动化技术满足高产能和低Jam Rate的量产要求。此外,可调式的压测力、位置校正和各种感应装置可降低待测物发生突如其来的损坏,以及帮助延长socket的使用期,保持或提升产能的良率。
产品性能特点
具有八个平行测试站点
9Kpcs 产能
Jam Rate 1/10000
弹性的多测点架构
减轻压测力
支持的芯片尺寸从 3x3 mm 到50x50 mm
温度测试范围从常温到高温150 ℃
连续自动重测功能
测试良率控制功能
二合一 shuttle
CE认证
Socket 自动清空功能* (选购)
* Socket clean pad needs to be provided by customers
技术参数
Model | 3180 |
Dimension (WxDxH) | 1860 mm x 1380 mm x 2050 mm |
Weight | Approx. 1300 kg |
Facility | Power : AC220, 50/60 Hz Single-Phase, 10 KVA Max. Compressed Air : 0.5 MPa or higher (dry and clean air) Flow Rate : 120 L/min., constant supply |
Applicable Device | Type : BGA, QFP, CSP, QFN, Flip chip, TSOP, etc. Package Size : 3 mm x 3 mm to 50 mm x 50 mm * |
Contact Mode | Direct contact / Drop and Press |
Interface | Standard : TTL, GPIB Option : RS232, TCPIP |
Multiple Site | Octal Sites (4x2) Matrix Quad Sites (2x2) In-line Quad Sites (4x1) |
Contact Area | Test Head Area : 583 mm (from socket center) Docking Height : 1100 mm (1000/1200mm option) |
Index Time | 0.4 sec (excluding tester communication time) |
Jam Rate | 1/10,000 |
Category | 6 categories (3 auto, 3 manual) |
Contact Force | Up to 120 kgf |
Mounting Type | Direct mount / Side Mount |
Applicable Tray | JEDEC |
Throughout (Max.) | Up to 9000 UPH (Illustrated by BGA 4x6, 20x37 tray matrix) |
High Temperature (Option) | Operating Range : ~ 150℃ (Heating time < 30 min.) Accuracy : Contact Head ± 3 ℃, Pre-heater ± 5 ℃ |