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3260
3260

台湾chroma 自动化系统功能测试机 3260

品牌名称:台湾Chroma

产品型号:3260

产品规格
产品介绍
靠的高速Pick&Place分类机
同步吸嘴双取及双放设计
具备处理QFP的能力
无测试座损坏的问题
浮动头可有效率衡测试压力
IC残留检测功能
发明专利字号190373, 190377,
1227324 & 125307
温度控制系统
三温变温控制
主动热控模块 (ATC)
高解热温控模块 (PTC)
渠道商
产品详情

3260 自动化系统功能测试机 

Chroma 3260是一款新型的测试机可供多组PCB level平行测试的大量生产机具。3260可配合多数不同的封装类型包括传统的QFP、TQFP、μBGA、PGA 及CSP封装。测试机采用取放的技术,可从JEDEC夹盘来拾取IC,移动到测试位置,然后将测试后产品放置于适当之Tray盘。

Chroma 3260以并排平行方式,进行测试。在高温下具有自动温度冷却(ATC)功能,其范围从摄氏50度到125度可测试1至6个测试座。

产品性能特点

  • 靠的高速Pick&Place分类机

  • 同步吸嘴双取及双放设计

  • 具备处理QFP的能力

  • 无测试座损坏的问题

  • 浮动头可有效率衡测试压力

  • IC残留检测功能

  • 发明专利字号190373, 190377,1227324 & 125307

  • 温度控制系统

    三温变温控制

    主动热控模块 (ATC)

    高解热温控模块 (PTC)


技术参数

Model

3260

Dimension (WxDxH)

2570 mm x 1360 mm x 1780 mm

Weight

1300 kg

Facility

Power : AC 220, 50/60 Hz   Single-Phase Maximum Power
Consumption : 6.0 KVA Max Controller Circuit : 3.0   KVA Max 
Heater Circuit : 3.0 KVA (Option)

Compressed Air

Dry Air of 5.0 kg/cm2 (0.49 Mpa)   or higher, constant supply

Vacuum Source

Build-in Diaphragm Vacuum Pump: Pumping   Volume : 100 L/min

Ultimate Pressure : 100 Torr (-13.3   Kpa) Max.

Applicable Device

Type : BGA series, µBGA, Pga, QFP   series, CSP, BCC, QFN, Flip-Chip,
TSOP Outer dimensions: 4 mm x 4 mm to 45 mm   x 45 mm

Lead / Ball pitch : 0.4 mm / 0.5   mm and above

Multiple Testing Layout

6 sites (Pitch 400 mm)

Index Time

3.0 sec (excluding test communication   time)/ One site cycle time : 3.5 Sec

Ram Rate

1/5000 pcs

Applicable Tray

JEDEC and EIAJ

Categories

4 categories (6 categories for option)

Contact Force

Max. 60 Kgf (accuracy ± 1kgf) by   servo motor (80 Kgf for Option)

 

Soak Hot Temperature (Option)

Operating Mode : Room   Temperature / High Temperature Temperature
Range : 50
to 150 (Heat-up time: Within 30 min) Accuracy : Pre-heater   Bu er ± 5, Contact Area ± 3

Cooling Head : 10 + 5

Temperature Control (Option)

Operating Mode : Room Temperature   / Cold Temperature

Temperature Range : room temperature   ~ -55 Accuracy : Contact Area ± 3

Tri Temp Control

(Option)

Temperature Range : -40 ~ 125 ± 2
(150 Option) or -55 ~ 135 ± 2 (150 Option)

ATC Module

(Option)

Temperature Range : Ambient ~ 135± 2 (150 Option)

Unity PTC

(Option)

Temperature Range : ~ 85 (up to 300W Heat Dissipation)

Tester Interface

Standard : RS-232

Option : GPIB, USB and TTL

Features

Universal kit design

ECD function (Easy-edit communication   define)
Two tray (Color tray) mode available Continuous fail retest function

Real pick and place system

Yield control (Average yield of socket)   Yield monitor (Per contact head plug)
System Invention Patent No.: 190373 Process   Invention Patent No.: 190377

Option

CCD camera for device orientation   detection Socket sensor / Socket CCD

RF Shielding Box : 55db for PCIe,   80~90db for PCI/USB/RS232 Rotator (90 degree)

Fault Auto Correlation Test (FACT)   Built in Continuity Test (BICT)PoP handling capacity


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